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The Sublym 100™ is a compact, user-friendly hot embossing machine designed for microfluidic chip replication and bonding. It provides an efficient and entirely electrically powered solution for thermoplastic molding, eliminating the need for pneumatic or hydraulic pumps. This machine serves two primary functions: it enables the microstructuring of thermoplastic polymers and facilitates the thermal bonding of different materials. The Sublym 100™ features internal temperature control ranging from 50°C to 180°C and uses a flexible vacuum-sealed membrane to apply molding pressure at 0.6 bar under atmospheric conditions. This mechanism generates a force between 1.2 kN and 1.8 kN.

Although specifically designed for Flexdym™ molding, a thermoplastic material developed by Eden Tech, the Sublym 100™ has also been proven effective for processing other thermoplastics, including PS, PMMA, and COC.

For more details, visit Eden Tech Sublym™.