Coating platform

The coating platform, located under a chemical hood, is an essential setup for fabricating master templates used in the production of microfluidic chips at our facility. It consists of a spin coater and two hot plates, each optimized for precision and efficiency.

The spin coater (model WS-650Mz-23NPPB from Laurell Technologies Corporation) automates critical deposition parameters such as time (1–59 seconds), speed (10–10,000 rpm), acceleration (up to 13,000 rpm/sec in 1 rpm/sec increments), and rotation direction. It accommodates substrates of various sizes, including circular wafers up to 150 mm in diameter, ensuring versatility for different fabrication needs. More information about the spin coater.

The hot plates (model EMS 1000-3 from Electronic Micro Systems) feature P.I.D. temperature controllers with digital readouts and hard-anodized aluminum surfaces, supporting substrates up to 150 mm in diameter. They offer a maximum temperature of 200°C, with 1% temperature uniformity across the working surface. To enhance usability, the plates are equipped with vacuum holes for secure substrate placement and lift pins for easy loading and unloading using a vacuum wand.